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US 2018/0019210 A1Published application
Integrated circuit apparatus
AssigneeMediatek Inc.
InventorsJui-Chih Kao, Ming-Da Tsai, Yuan-Yu Fu, Chih-Chun Hsu
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Abstract
An integrated circuit apparatus includes a substrate, an IC chip disposed above the substrate, and an electromagnetic shielding layer disposed on a surface of the substrate. The IC chip includes an electromagnetic coupling device. The electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.
Claims21
An integrated circuit (IC) apparatus comprising:
- a substrate;
- an IC chip disposed above the substrate, the IC chip comprising an electromagnetic coupling device;
- and
- an electromagnetic shielding layer disposed on a surface of the substrate, wherein the electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.
1 more element
Dependencies are inferred from the claim text.