Interposer, module, and method of producing interposer

A module, comprising:

• an interposer;
• and
• a semiconductor device mounted on the interposer,
• the interposer including a resin lamination including connection terminals for a main board on one surface, and a glass sheet that is fixed along another surface of the resin lamination,
• the glass sheet having an exposed portion exposed from the resin lamination, the exposed portion being at least a part of a surface not facing to the resin lamination, the glass sheet including connection terminals for a semiconductor device on a surface of the exposed portion, and wiring being formed on a surface of the exposed portion to interconnect the connection terminals with an edge of the exposed portion.

A method of producing an interposer, comprising:

• preparing a support having a flat surface;
• forming a wiring pattern on the flat surface of the support;
• placing a glass sheet on a region of the support, no wiring pattern being formed on the region;
• then covering the wiring pattern and the glass sheet with insulation resin, and forming a wiring layer that is electrically connected to the wiring pattern on the insulation resin;
• then separating the wiring pattern, the glass sheet, and the wiring layer that are integrated by the insulation resin from the support;
• and
• then forming, on a surface that does not face to the resin lamination of the glass sheet, connection terminals for a semiconductor device and wiring that interconnects the connection terminals with edges of the exposed portion.