Ball grid array (bga) with anchoring pins
AssigneeIntel Corporation
InventorsZuyang Liang, Michael Garcia, Joshua D. Heppner, Srikant Nekkanty
Life of this patent
Estimating the term…
Abstract
Embodiments herein may relate to an electronic device that includes a board. The electronic device may include a device physically coupled with the board by an anchoring pin. The electronic device may further include a plurality of ball grid array (BGA) solder joints coupled with the device. For example, the BGA solder joints may electrically and/or communicatively couple one or more pins of the device with the board. The BGA solder joints may have a shape that is different than the anchoring pin. Other embodiments may be described and/or claimed.
Claims26
An electronic device comprising:
- a board;
- a device physically coupled with the board by an anchoring pin that extends through the board, the anchoring pin to carry ground signals to or from the board;
- and
- a plurality of ball grid array (BGA) solder joints coupled with the device, wherein the BGA solder joints electrically and communicatively couple one or more pins of the device with the board, wherein the BGA solder joints have a shape that is different than the anchoring pin.
An electronic device comprising:
- a board;
- a device physically coupled with the board by an anchoring pin, the anchoring pin to carry ground signals to or from the board;
- and
- a plurality of ball grid array (BGA) solder joints coupled with the device, wherein the BGA solder joints electrically and communicatively couple one or more pins of the device with the board, wherein the BGA solder joints have a shape that is different than the anchoring pin, and wherein the anchoring pin is coupled with a surface of the board.
(canceled)
(canceled)
A method comprising:
- electrically coupling one or more pins of a device with a board via one or more ball grid array (BGA) solder joints;
- and
- physically coupling the device with the board via an anchoring pin that has a shape and a material composition that is different than a shape and a material composition of the one or more BGA solder joints, the anchoring pin to carry ground signals to or from the board.
(canceled)
(canceled)
An electronic device comprising:
- a board;
- a device physically coupled with the board by an anchoring pin, wherein the anchoring pin is directly coupled with a plate at a perimeter of the device, the anchoring pin to carry ground signals to or from the board;
- and
- a plurality of ball grid array (BGA) solder joints coupled with the device, wherein the BGA solder joints electrically and communicatively couple one or more pins of the device with the board, wherein the BGA solder joints have a shape that is different than the anchoring pin.
22-23. (canceled)
Dependencies are inferred from the claim text.