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US 2018/0019192 A1Published application
Semiconductor package
AssigneeMediatek Inc.
InventorNan-Jang Chen
Life of this patent
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Abstract
A semiconductor package includes a substrate, a conductive layer, a first surface mount device (SMD) and a bonding wire. The substrate has a t top surface. The first conductive layer is formed on the top surface and has a first conductive element and a first pad separated from each other. The first SMD is mounted on the first pad, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.
Claims19
A semiconductor package, comprising:
- a substrate having a top surface;
- a conductive layer formed on the top surface and having a first conductive element and a first pad separated from each other;
- a surface mount device (SMD) mounted on the first pad, overlapping with and electrically isolated from the first conductive element;
- and
- a bonding wire electrically connect the SMD with the first conductive layer.
2 more elements
A semiconductor package, comprising:
- a first substrate having a first top surface;
- a first conductive layer formed on the first top surface and having a first conductive element and a second conductive element separated from each other;
- a first surface mount device (SMD) mounted on the first top surface and electrically isolated from the first conductive element;
- a first bonding wire electrically connect the first SMD with the first conductive layer;
- and
- a second SMD having a second top surface and a first bump pad disposed between the first substrate and the first SMD, through which the first SMD is mounted on the first bump pad of the second top surface and electrically isolated from the first conductive element.
3 more elements
A semiconductor package, comprising:
- a substrate having a top surface;
- a conductive layer formed on the top surface and having a first conductive element, a first bump pad and a second bump pad separated from each other;
- a surface mount device (SMD) mounted on the first bump pad and the second bump pad;
- and
- a bonding wire is electrically connected the SMD with the first conductive layer.
2 more elements
Dependencies are inferred from the claim text.