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US 2018/0019191 A1Published application
Conductive connections, structures with such connections, and methods of manufacture
AssigneeInvensas Corporation
InventorsCyprian Emeka UZOH, Rajesh Katkar
Life of this patent
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Abstract
A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.
Claims22
A manufacturing method comprising:
- obtaining a first structure comprising:
- one or more first components each of which comprises solder and a material sublimatable or vaporizable when the solder is melted;
- and
- a first layer comprising a top surface and one or more holes in the top surface, each hole containing at least a segment of a corresponding first component;
- heating each first component to sublimate or vaporize at least part of each sublimatable or vaporizable material and provide an electrically conductive connection at a location of each first component;
- wherein in the heating operation at least part of each first component recedes down from the top surface to provide or increase a recess in each hole at the top surface.
3 more elements
Dependencies are inferred from the claim text.