Semiconductor device manufacturing method
AssigneeRenesas Electronics Corporation
InventorsKatsuhito KAMACHI, Hideaki TAMIMOTO
Life of this patent
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Abstract
A semiconductor device manufacturing method which enhances the reliability of a semiconductor device. The method includes a step in which a source wire is connected with a semiconductor chip while jigs are pressed against a die pad. The jigs each have a first support portion with a first projection and a second support portion with a second projection. Using the jigs thus structured, the first projection is made to contact with a first point on the front surface of the die pad and then the second projection is made to contact with a second point on the front surface of the die pad located closer to a suspension lead than the first point.
Claims20
1-20. (canceled)
A method of manufacturing a semiconductor device, comprising:
- (a) providing a lead frame having a lead, a die pad, and a suspension lead connected to the die pad and bent along a thickness direction of the die pad;
- (b) after (a), mounting a semiconductor chip on a first surface of the die pad;
- and
- (c) after (b), electrically connecting the semiconductor chip with the lead via a conductive member,
- wherein (c) comprises:
- (c1) providing a stage having a front surface, and a first jig having a first support portion and a second support portion;
- (c2) after (c1), arranging the lead frame over the stage such that a second surface of the die pad, opposite to the first surface, faces the front surface of the stage, and such that a first part of the second surface of the die pad is spaced apart from the front surface of the stage, while a second part of the second surface is contacted with the front surface of the stage, the second part of the second surface being closer to the suspension lead than the first part of the second surface;
- (c3) after (c2), contacting the first part of the second surface of the die pad with the front surface of the stage by pressing the first jig against the first surface of the die pad;
- and
- (c4) after (c3), connecting the conductive member with the semiconductor chip, while contacting the first and second parts of the second surface with the front surface of the stage by pressing the first jig against the first surface of the die pad,
- wherein, in (c), ultrasonic waves are applied to an area of contact between the semiconductor chip and the conductive member, and
- wherein (c3) comprises:
- (c31) making a first convex part of the first support portion of the first jig contact with a first point on the first surface of the die pad;
- and
- (c32) after (c31), making a second convex part of the second support portion of the first jig contact with a second point, which is located closer to the suspension lead than the first point, on the first surface of the die pad by warping the first support portion.
Dependencies are inferred from the claim text.