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US 2018/0019188 A1Published application
Stretchable semiconductor packages and semiconductor devices including the same
AssigneeSK hynix Inc.
InventorsJong Hoon KIM, Han Jun BAE, Chan Woo JEONG
Life of this patent
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Abstract
A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.
Claims19
A semiconductor package comprising:
- a molding member comprised of an extendible material, wherein the molding member includes a first part having a warped shape, a second part extending from one end of the first part to be flat, and a third part extending from the other end of the first part to be flat;
- a chip embedded in the molding member to have a warped shape;
- and
- connectors disposed in the molding member,
- wherein first surfaces of the connectors are exposed at a surface of the molding member and second surfaces of the connectors are coupled to the chip.
2 more elements
A semiconductor device comprising:
- a substrate comprised of a flexible and extendible material, wherein the substrate includes conductive patterns disposed therein and the conductive patterns are exposed at a surface of the substrate;
- a semiconductor package including an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member, wherein first surfaces of the connectors are exposed at a surface of the molding member and second surfaces of the connectors are coupled to the chip;
- and
- joint electrodes connecting the conductive patterns to the connectors,
- wherein the molding member includes a first part having a warped shape, a second part extending from one end of the first part to be flat, and a third part extending from the other end of the first part to be flat.
2 more elements
Dependencies are inferred from the claim text.