Chip package with thermal dissipation structure and method for forming the same

A chip package, comprising:

• a first package structure, comprising:
• a first semiconductor die having a first side and a second side opposite thereto;
• a package layer at least partially encapsulating the first semiconductor die;
• a conductive feature in the package layer;
• a base layer over the first side of the first semiconductor die;
• a first heat-spreading layer electrically insulating from the first semiconductor die by the base layer;
• a first cap layer on the first heat-spreading layer;
• a second heat-spreading layer on the first cap layer;
• and
• a second cap layer on the second heat-spreading layer.

A chip package, comprising:

• a first package structure, comprising:
• a first semiconductor die having a first side and a second side opposite thereto;
• a package layer at least partially encapsulating the first semiconductor die;
• a conductive feature in the package layer;
• a first heat-spreading layer disposed above a hot spot region over the first side of the first semiconductor die, wherein the first heat-spreading layer has a first area;
• a first cap layer on the first heat-spreading layer;
• a second heat-spreading layer on the first cap layer, wherein the second heat-spreading layer has a second area greater than the first area;
• and
• a second cap layer on the second heat-spreading layer.