Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorYasuo KONISHI
Life of this patent
Estimating the term…
Abstract
Provided is a technique for enhancing heat dissipation properties in dissipating heat generated in an electrode to a heatsink without impairing bonding properties between the electrode and a wire. In a semiconductor device, a portion of an electrode within an inner region defined by a case, at one surface, i.e., the lower surface with respect to a position in which a wire is connected, a resin portion is provided, the resin portion extending from an inner wall of the case to an upper-surface side of the heatsink. Additionally, in the portion of the electrode within the inner region defined by the case, at one surface, i.e., the lower surface with respect to a position in which the wire is not connected, a thermal conductor is provided, the thermal conductor having higher heat conductivity than the resin portion.
Claims5
A semiconductor device comprising:
- a heatsink;
- an insulating substrate disposed above said heatsink;
- a semiconductor element disposed above said insulating substrate;
- a case made of resin, said case enclosing an upper-surface side of said heatsink, said insulating substrate, and said semiconductor element;
- and
- an electrode including a portion within an inner region defined by said case, said electrode being electrically connected to said semiconductor element at one surface of said portion through a wire,
- wherein in said portion of said electrode within said inner region defined by said case, at another surface with respect to a position in which said wire is connected, a resin portion is provided, said resin portion extending from an inner wall of said case to said upper-surface side of said heatsink, and
- wherein in said portion of said electrode within said inner region defined by said case, at another surface with respect to a position in which said wire is not connected, a heat conductor is provided, said heat conductor having higher thermal conductivity than said resin portion.
A semiconductor device comprising:
- a heatsink;
- an insulating substrate disposed above said heatsink;
- a semiconductor element disposed above said insulating substrate;
- a case made of resin, said case enclosing an upper-surface side of said heatsink, said insulating substrate, and said semiconductor element;
- and
- an electrode including a portion within an inner region defined by said case, said electrode being electrically connected to said semiconductor element at one surface of said portion through a wire,
- wherein another surface of said portion of said electrode within said inner region defined by said case is uneven, and
- wherein at said another surface of said portion of said electrode within said inner region defined by said case, a resin portion is provided, said resin portion extending from an inner wall of said case to said upper-surface side of said heatsink and having an uneven portion fitted in said another surface of said portion.
Dependencies are inferred from the claim text.