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US 2018/0019177 A1Published application
Electronic component and manufacturing method thereof
AssigneeRohm Co., Ltd.
InventorsYusuke HARADA, Yasuhiro FUWA
Life of this patent
Estimating the term…
Abstract
An electronic component includes a substrate having a principal surface, a chip arranged at the principal surface of the substrate, a sealing resin sealing the chip on the principal surface of the substrate, and a heat dissipation member formed on the sealing resin.
Claims29
An electronic component comprising:
- a substrate having a principal surface;
- a chip arranged at the principal surface of the substrate;
- a sealing resin sealing the chip on the principal surface of the substrate;
- and
- a heat dissipation member formed on the sealing resin.
2 more elements
An electronic component comprising:
- a substrate having a principal surface at which a recessed portion is formed;
- a chip arranged at the principal surface of the substrate so as to be accommodated in the recessed portion;
- a sealing resin filling the recessed portion and sealing the chip;
- and
- a heat dissipation member formed on the sealing resin.
2 more elements
A method for manufacturing an electronic component comprising the steps of:
- preparing a substrate having a principal surface;
- arranging a chip at the principal surface of the substrate;
- supplying a sealing resin onto the principal surface of the substrate and sealing the chip with the sealing resin;
- and
- forming a heat dissipation member on the sealing resin.
2 more elements
A method for manufacturing an electronic component comprising the steps of:
- preparing a substrate having a principal surface;
- forming a recessed portion at the principal surface of the substrate;
- arranging a chip at the principal surface of the substrate so as to be accommodated in the recessed portion;
- supplying a sealing resin onto the principal surface of the substrate so as to fill the recessed portion and seal the chip with the sealing resin;
- and
- forming a heat dissipation member on the sealing resin.
3 more elements
Dependencies are inferred from the claim text.