Semiconductor package device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsBernd Karl APPELT, Kay Stefan ESSIG
Life of this patent
Estimating the term…
Abstract
A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die and the first adhesive layer, and a first conductive via disposed in the first adhesive layer and electrically connected to the first die.
Claims20
A semiconductor package device, comprising:
- a first die, having a first surface and a second surface opposite to the first surface;
- a first adhesive layer disposed on the first surface of the first die;
- an encapsulant layer encapsulating the first die and the first adhesive layer;
- and
- a first conductive via disposed in the first adhesive layer and electrically connected to the first die.
A semiconductor package device, comprising:
- a power device comprising a first conductive pad;
- an adhesive layer disposed on the power device;
- a package body encapsulating the power device and the adhesive layer;
- a first conductive post disposed in the adhesive layer and contacting the first conductive pad;
- and
- a seed layer disposed between the first conductive pad and the first conductive post.
A method of manufacturing a semiconductor package device, the method comprising:
- providing a carrier having a first conductive layer disposed thereon;
- forming an adhesive layer on the first conductive layer;
- attaching a first side of a die to the adhesive layer, the die comprising at least one conductive pad disposed at the first side;
- encapsulating the die and the adhesive layer with an encapsulant layer;
- removing the carrier;
- removing a portion of the first conductive layer to expose a portion of the adhesive layer;
- removing the exposed portion of the adhesive layer to form a first opening in the adhesive layer;
- and
- filling the first opening with a conductive material to form a first conductive via.
Dependencies are inferred from the claim text.