Semiconductor device and method for manufacturing the same
AssigneeNanya Technology Corporation
InventorPO CHUN LIN
Life of this patent
Estimating the term…
Abstract
One aspect of the present disclosure provides a semiconductor device. In some embodiments, the semiconductor device includes an integrated circuit die, at least one conductive terminal disposed on the integrated circuit die, a frame positioned on the integrated circuit die, wherein the frame substantially exposes the at least one conductive terminal, and at least one conductive bump positioned in the frame, wherein the at least one conductive bump electrically connects the at least one conductive terminal.
Claims19
A semiconductor device, comprising:
- an integrated circuit die;
- at least one conductive terminal disposed on the integrated circuit die;
- a frame positioned on the integrated circuit die, wherein the frame substantially exposes the at least one conductive terminal;
- and
- at least one conductive bump positioned in the frame, wherein the at least one conductive bump electrically connects the at least one conductive terminal,
- wherein the frame comprises a supporting layer of non-conductive material selected from the group consisting of silicon and silicon oxide.
(canceled)
A semiconductor package, comprising:
- a semiconductor device having at least one conductive terminal;
- a frame positioned on the semiconductor device, wherein the frame substantially exposes the at least one conductive terminal;
- at least one conductive bump positioned in the frame, wherein the at least one conductive bump electrically connects the at least one conductive terminal;
- an object having at least one conductive pad;
- and
- an adhesive layer interposed between the semiconductor device and the object,
- wherein the frame comprises a supporting layer of non-conductive material selected from the group consisting of silicon and silicon oxide.
(canceled)
A method for manufacturing a semiconductor package, comprising the steps of:
- preparing a semiconductor device having at least one conductive terminal;
- forming a frame on the semiconductor device, wherein the frame substantially exposes the at least one conductive terminal, wherein the frame comprises a supporting layer of non-conductive material selected from the group consisting of silicon and silicon oxide;
- and
- forming at least one conductive bump in the frame, wherein the at least one conductive bump electrically connects the at least one conductive terminal.
Dependencies are inferred from the claim text.