Semiconductor device and casing of the semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorKousuke KOMATSU
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled in the casing, a first conductive block disposed in the casing, and a first connection terminal being bent so as to implement an elongated U-shape. The semiconductor device is adapted for electrical connection to a circuit board having a first land. The circuit board is placed on the ceiling wall. The first window is at a position corresponding to the first land. A lower end of the first conductive block is connected to a surface of the output electrode and the first connection terminal contacts to the first conductive block.
Claims10
A semiconductor device for electrical connection to a circuit board having a first land, comprising:
- a box-shaped casing including a ceiling wall, on which the circuit board is placed, the ceiling wall is provided with a first window at a position corresponding to the first land;
- a semiconductor chip assembled in the casing, the semiconductor chip having an output electrode;
- a first conductive block disposed in the casing, a lower end of the first conductive block being connected to a surface of the output electrode;
- and
- a first connection terminal being bent so as to implement an elongated U-shape in a cross-sectional view, configured to provide a pair of opposite surfaces in the U-shape, the first connection terminal is scheduled to be connected to the first land through an upper end implemented by a bottom of the U-shape via the first window, both sides of an upper part of the first conductive block being interposed between the opposite surfaces at a lower end implemented by a top of the U-shape, the first connection terminal contacts to the first conductive block through the opposite surfaces.
A casing of a semiconductor device for electrically connecting the semiconductor device to a circuit board having a land, comprising:
- a box-shaped outer wall including a ceiling wall on which the circuit board is placed, the ceiling wall is provided with a window at a position corresponding to the land;
- a connection terminal being bent so as to implement an elongated U-shape in a cross-sectional view, configured to provide a pair of opposite surfaces in the U-shape, the connection terminal is scheduled to be connected to the land through an upper end implemented by a bottom of the U-shape via the window, the connection terminal is adapted for connecting to a semiconductor chip, which is scheduled to be mounted in the outer wall through the opposite surfaces at a lower end implemented by a top of the U-shape;
- and
- a pair of supporting side-walls fixed to the outer wall, the supporting side-walls facing each other, the supporting side-walls covering the connection terminal except the upper end in the outer wall, the supporting side-walls establish a narrow constriction, which defines a smallest width between the pair of supporting side-walls, and the supporting side-walls supporting the connection terminal through the narrow constriction.
Dependencies are inferred from the claim text.