Defect inspection and repairing method and associated system and non-transitory computer readable medium
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsNAI-HAN CHENG, CHI-MING YANG
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Abstract
A defect inspection and repairing method is disclosed. The method includes: providing a wafer including a semiconductor chip disposed on a surface of the wafer; disposing a layer over the semiconductor chip; obtaining a scanned image of the disposed layer; performing an image analysis upon the scanned image to obtain a defect information; and generating a recipe of a beam according to the defect information, wherein the beam is configured to apply on the disposed layer. Associated system and non-transitory computer-readable medium are also disclosed.
Claims20
A defect inspection and repairing method, comprising:
- providing a wafer including a semiconductor chip disposed on a surface of the wafer;
- disposing a layer over the semiconductor chip;
- obtaining a scanned image of the disposed layer;
- performing an image analysis upon the scanned image to obtain a defect information;
- and
- generating a recipe of a beam according to the defect information, wherein the beam is configured to apply on the disposed layer.
A defect inspection and repairing system for a wafer, wherein the wafer includes a semiconductor chip disposed thereon, and the semiconductor chip includes a layer disposed thereon, the system comprising:
- an inspection unit, used for obtaining a scanned image of the disposed layer, performing an image analysis upon the scanned image to obtain a defect information;
- and generating a recipe of a beam according to the defect information, wherein the beam is configured to apply on the disposed layer;
- and
- a repairing unit, used for generating the beam to isolate at least two bridged conductive traces or connect at least two isolated conductive traces.
A non-transitory computer-readable medium containing therein instructions which, when executed by a computer, cause the computer to perform the actions comprising:
- obtaining a scanned image of a layer disposed on a semiconductor chip, wherein the semiconductor chip is disposed on a wafer;
- performing an image analysis upon the scanned image to obtain a defect information;
- and
- generating a recipe of a beam according to the defect information, wherein the beam is configured to apply on the disposed layer.
Dependencies are inferred from the claim text.