Method for processing one semiconductor wafer or a plurality of semiconductor wafers and protective cover for covering the semiconductor wafer

A method for processing a semiconductor wafer,

• the semiconductor wafer comprising:
• a first main processing side and a second main processing side, which is situated opposite the first main processing side;
• at least one circuit region having at least one electronic circuit on the first main processing side;
• the method comprising:
• forming a stiffening structure, which at least partly surrounds the at least one circuit region and which stiffens the semiconductor wafer, wherein the stiffening structure has a cutout at least above part of the at least one circuit region;
• forming a filling body in the cutout, which filling body is in physical contact with the circuit region and differs from the stiffening structure;
• and
• thinning the semiconductor wafer, comprising the stiffening structure and the filling body, from the second main processing side.

A method for processing a first semiconductor wafer and a second semiconductor wafer,

• each semiconductor wafer comprising:
• a first main processing side and a second main processing side, which is arranged opposite the first main processing side;
• at least one circuit region having at least one electronic circuit on the first main processing side;
• the method comprising:
• forming a stiffening structure, which at least partly surrounds the at least one circuit region of the first semiconductor wafer and which stiffens the first semiconductor wafer, wherein the stiffening structure has a cutout at least above part of the at least one circuit region of the first semiconductor wafer;
• processing the first semiconductor wafer;
• removing the stiffening structure from the first semiconductor wafer;
• and
• stiffening the second semiconductor wafer by means of the stiffening structure.

A method for processing a semiconductor wafer,

• the semiconductor wafer comprising:
• a first main processing side and a second main processing side, which is arranged opposite the first main processing side;
• at least one circuit region having at least one electronic circuit on the first main processing side;
• the method comprising:
• forming a protective cover above the circuit region, wherein the protective cover has a cutout at least above part of the at least one circuit region, said cutout being opened towards the circuit region;
• sealing the cutout in a dust-tight fashion by means of a closure;
• processing the semiconductor wafer, comprising the protective cover from the second main processing side.