Multilayer capacitor and board having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Ok HAN, Jin Kyung JOO, Jin Ju PARK, Jae Yeol CHOI, Hong Seok KIM
Life of this patent
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Abstract
A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively; and first and second via electrodes formed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.
Claims30
A multilayer capacitor comprising:
- a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively;
- and
- first and second via electrodes formed in the first and second groove parts, respectively, and connected to the first and second internal electrodes, respectively.
A multilayer capacitor comprising:
- a capacitor body including dielectric layers, first and second internal electrodes including first and second body portions alternately disposed, with one of the dielectric layers interposed therebetween and overlapping each other and first and second lead portions extending from the first and second body portions to be exposed to a mounting of the capacitor body, respectively, and first and second groove parts formed to extend in a first direction in which the dielectric layers are stacked, in the mounting to which the first and second lead portions are exposed, and contacting the first and second lead portions, respectively;
- and
- first and second via electrodes formed in the first and second groove parts, respectively, and connected to the first and second lead portions, respectively.
A multilayer capacitor comprising:
- a capacitor body including dielectric layers, and first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween;
- and
- first and second via electrodes partially embedded in the capacitor body and electrically connected to the first and second internal electrodes, respectively,
- wherein a first exterior surface of the capacitor body and at least one of an exterior surface of the first via electrode exposed by the capacitor body and an exterior surface of the second via electrode exposed by the capacitor body are flush with each other.
A method for manufacturing multilayer capacitors, the method comprising:
- forming a multilayer body including a plurality of units each including first and second internal electrodes alternately stacked, with one or more dielectric layers interposed therebetween;
- forming a plurality of holes penetrating through the multilayer body such that the first and second internal electrodes of the plurality of units are exposed by the plurality of holes;
- filling the plurality of holes with a conductive material;
- and
- forming a plurality of capacitor bodies by cutting the multilayer body along at least paths passing through the plurality of holes filled with the conductive material.
Dependencies are inferred from the claim text.