Method of manufacturing coil unit in thin film type for compact actuator

Abstract

Provided is a method of manufacturing a coil unit in a thin film type for a compact actuator, and more particularly, a method of manufacturing a coil unit in a thin film type for a compact actuator in which a buffer layer is formed on a coil layer to prevent cracks in the coil layer and a substrate. According to the method of manufacturing the coil unit in a thin film type for a compact actuator of the present invention, the buffer layer is formed on the coil layer so that an impact to the coil layer during a back-grinding process for thinning a substrate is absorbed, thereby preventing the substrate and the coil layer from breaking due to the back-grinding process and compensating for a difference of deformation between the coil unit and the substrate according to a difference of coefficients of thermal expansion. Further, according to the present invention, as the substrate is thinned by performing a back-grinding process, a gap which is a distance between a permanent magnet and the coil layer is reduced, and therefore sensitivity of the compact actuator can be improved.

Dependencies are inferred from the claim text.