Grain Boundary Healing Glasses And Their Use In Transparent Enamels, Transparent Colored Enamels And Opaque Enamels

28:

• The method of claim 27, wherein the grain-boundary-healing additive is selected from the group consisting of molybdenum (V) ethoxide, molybdenyl triethoxide, molybdenyl acetylacetonate, tungsten(V) ethoxide, tungsten(VI) ethoxide, tungsten(VI) isopropoxide, trimethylene borate, triethyl borate, triisopropyl borate, trimethyl borate, niobium(V) ethoxide, niobium(V) isopropoxide, niobium(V) n-propoxide, niobium(V) n-butoxide, niobium(V) n-pentyloxide, tantalum(V) methoxide, tantalum(V) ethoxide, tantalum(V) isopropoxide, antimony(III) methoxide, antimony(III) ethoxide, antimony(III) isopropoxide, bismuth(III) tert-pentyloxide, tin(II) oxalate, tin(IV) methoxide, tin(IV) ethoxide, tin(IV) isopropoxide, tin(IV) tert-butoxide, germanium(IV) methoxide, germanium(IV) ethoxide, germanium(IV) isopropoxide, germanium(IV) n-butoxide, tellurium(IV) ethoxide, barium ethoxide, barium isopropoxide, indium(III) ethoxide, indium(III) isopropoxide, gallium(III) ethoxide, gallium(III) isopropoxide, aluminum(III) ethoxide, aluminum(III) isopropoxide, aluminum(III) n-butoxide, aluminum(III) sec-butoxide, aluminum(III) tert-butoxide, yttrium(III) isopropoxide, zinc(II) methoxyethoxide, silicon(IV) ethoxide and silicon(IV) isopropoxide.

29:

• The method of claim 27, wherein the organometallic compound comprises at least one phosphorus compound selected from the group consisting of phosphites, phosphonites, phosphates and phosphonates.

30:

• The method of claim 29, wherein the at least one phosphorus compound is a phosphonate selected from the group consisting of 2-phosphonopropionic acid, 3-phosphonopropionic acid, diethyl 2,2-diethoxyethyl phosphonate, diethyl hydroxymethylphosphonate, diisopropyl methylphosphonate, diethyl 2,2-dimethoxyethylphosphonate, ethylphosphonic acid, methylphosphonic acid, methylenediphosphonic acid and 1,2 ethylenediphosphonic acid.

31:

• The method of claim 27, wherein the grain-boundary-healing additive comprises an inorganic acid or a salt of an inorganic acid.

32:

• The method of claim 31, wherein the grain-boundary-healing additive is selected from the group consisting of boric acid, phosphoric acid, telluric acid, hexafluoro-silicic acid, hexafluoro-phosphoric acid, tetrafluoroboric acid, hexafluoroantimonic acid, dihydrogen hexafluorozirconate, molybdic acid, nitric acid, tungstic acid, borax, mono-ammonium phosphate, mono-sodium phosphate, tri-sodium phosphate, sodium nitrate, potassium nitrate, sodium hexa-fluorosilicate, potassium hexa-fluorosilicate, sodium hexafluorosilicate and sodium hexa-fluorophosphate.

33:

• The method of claim 27, further comprising adding a coloring agent to the glass batch.

34:

• The method of claim 33 wherein the coloring agent is selected from the group consisting of V2O5, Cr2O3, MnO2, Fe2O3, CoO, NiO, CuO, Ga2O3, GeO2, Nb2O5, MoO3, Ag2O, In2O3, La2O3, WO3, SnO2, Sb2O3, SO3, SeO2, TeO2 and combinations thereof.

35:

• The method of claim 27, wherein the glass frit includes at least one of transparent glass frit, colored transparent glass frit, or opaque glass frit.

36:

• The method of claim 27, wherein the glass frit comprises Bi, Zn and B, and the grain-boundary-healing additives include phosphorus.

39:

• The method of claim 38, wherein contacting includes dissolving the grain-boundary-healing additive in the organic carrier to form a solution and adding the frit to the solution to form the enamel paste.

40:

• The method of claim 38, wherein a coloring additive is dissolved in the solution.

41:

• The method of claim 38, wherein the grain-boundary-healing additive comprises an organometallic compound containing at least one of Li, Na, K, Ba, V, Mn, Mo, W, Zn, In, Ga, Al, B, Si, P, Fe, Ta, Sb, Bi, Sn, Ge, Te, Y and As.

42:

• The method of claim 38, wherein the organometallic compound comprises a phosphonate compound.

43:

• The method of claim 38, wherein the grain-boundary-healing additive comprises an inorganic acid or a salt of an inorganic acid.

44:

• The method of claim 38, wherein contacting the grain-boundary-healing additive to the glass frit is performed during milling.

45:

• The method of claim 38, wherein milling is performed in the presence of a liquid which combines with the glass frit to form a slurry, and wherein the grain-boundary-healing additive is added to the slurry.

46:

• The method of claim 38, further comprising removing liquid from the slurry wherein the grain-boundary-healing additive is deposited onto surfaces of the glass frit.