Embedded power module
AssigneeOtis Elevator Company
InventorShashank Krishnamurthy
Life of this patent
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Abstract
An embedded power module includes a substrate, first and second semiconducting dies, first and second gates, and first and second vias. The first semiconducting die is embedded in the substrate and spaced between opposite first and second surfaces of the substrate. The second semiconducting die is embedded in the substrate, is spaced between the first and second surfaces, and is spaced from the first semiconducting die. The first gate is located on the first surface. The second gate is located on the second surface. The first via is electrically engaged to the first gate and the second semiconducting die, and the second via is electrically engaged to the second gate and the first semiconducting die.
Claims20
An embedded power module comprising:
- a substrate including opposite first and second surfaces;
- a first semiconducting die embedded in the substrate and spaced between the first and second surfaces;
- a second semiconducting die embedded in the substrate, spaced between the first and second surfaces, and spaced from the first semiconducting die;
- a first gate located on the first surface;
- a second gate located on the second surface;
- a first via electrically engaged to the first gate and the second semiconducting die;
- and
- a second via electrically engaged to the second gate and the first semiconducting die.
A transport system in a structure comprising:
- a car constructed and arranged to move along a lane generally defined at least in-part by the structure;
- and
- a plurality of motor modules distributed along the lane and constructed and arranged to propel the car, each one of the plurality of motor modules including an embedded power module.
Dependencies are inferred from the claim text.