Thermal print head
AssigneeRohm Co., Ltd.
InventorsIsamu NISHIMURA, Yasuhiro FUWA
Life of this patent
Estimating the term…
Abstract
A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.
Claims34
A thermal print head comprising:
- a semiconductor substrate;
- a resistor layer formed on/over the semiconductor substrate and including a plurality of heat generating portions arranged in a main scanning direction;
- a wiring layer formed on/over the semiconductor substrate and included in a conduction path for energizing the plurality of heat generating portions;
- and
- an insulating protective layer covering the wiring layer and the resistor layer,
- wherein the semiconductor substrate includes an obverse surface, a reverse surface, and a projection, the obverse surface and the reverse surface being spaced apart from each other in a thickness direction, the projection projecting from the obverse surface in the thickness direction and elongated in the main, scanning direction,
- the projection includes a top surface, a first inclined side surface, and a second inclined side surface, the top surface being parallel to the obverse surface and spaced apart from the obverse surface in the thickness direction, the first inclined side surface and the second inclined side surface being spaced apart from each other in a sub-scanning direction with the top surface intervening therebetween, each of the first and the second inclined side surfaces being inclined relative to the obverse surface, and
- the plurality of heat generating portions overlap with the first inclined side surface as viewed in the thickness direction.
Dependencies are inferred from the claim text.