Bendable glass articles with alkali-free glass elements

A bendable stack assembly, comprising:

• a glass element having a composition substantially free of alkali ions,
• an elastic modulus of about 40 GPa to about 100 GPa,
• a KIC fracture toughness of at least 0.6 MPa·m1/2,
• a thickness from about 20 μm to about 100 μm,
• a first primary surface substantially in tension upon a bending of the element, and
• a second primary surface substantially in compression upon the bending;
• and
• a protect layer on the first primary surface.

A bendable electronic device assembly, comprising:

• a bendable backplane having a glass composition substantially free of alkali ions,
• an elastic modulus of about 40 GPa to about 100 GPa,
• a final thickness from about 20 μm to about 100 μm,
• a first primary surface substantially in tension upon a bending of the backplane, and
• a second primary surface substantially in compression upon the bending, the primary surfaces characterized by a prior material removal to the final thickness from an initial thickness that is at least 20 μm greater than the final thickness;
• a protect layer on the first primary surface of the backplane;
• and
• a plurality of electronic components on the second primary surface of the backplane,
• wherein the backplane is characterized by an absence of failure when the backplane is held during the bending at a bend radius of about 15 mm for at least 60 minutes at about 25° C. and about 50% relative humidity.