Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board
AssigneeHitachi Chemical Company, Ltd.
InventorsMasaki TAKEUCHI, Yoshitsugu MATSUURA, Yuta NAKANO, Kazuhito OBATA, Katsuhiko YASU
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Abstract
The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.
Claims11
A resin film for a flexible printed circuit board consisting of a resin composition comprising:
- a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain;
- and
- a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.
A flexible printed circuit board comprising:
- an insulating substrate having a conductive pattern;
- and
- a resin layer provided on at least one surface of the insulating substrate,
- wherein the resin layer contains a cured product of a resin composition comprising:
- a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain;
- and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.
Dependencies are inferred from the claim text.