Multi-layer preform sheet
AssigneeNapra Co., Ltd.
InventorsShigenobu SEKINE, Chihiro SHIMAYA
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Abstract
PROBLEM: To provide a multi-layer preform sheet capable of forming a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion and so forth that are less likely to produce the Kirkendall void. SOLUTION: A multi-layer preform sheet having at least a first layer and a second layer, the first layer being composed of a solder material that contains an intermetallic compound, and the second layer containing a first metal having a melting point of 300° C. or above, and a second metal capable of forming an intermetallic compound with the first metal.
Claims1
A multi-layer preform sheet comprising at least a first layer and a second layer,
- the first layer being mainly composed of Sn or Sn alloy, and containing at least 2% by weight of an intermetallic compound of Cu and Sn,
- the first layer being intended for taking part in bonding,
- the second layer containing a first metal and a second metal,
- the first metal being Cu or Cu alloy, and the second metal being Sn or Sn alloy, and
- the second metal being an alloy is a formed metal particle comprising an intermetallic compound dispersed in the metal particle and forming an outer shell structure on the metal particle.
Dependencies are inferred from the claim text.