Multi-layered nano-fibrous cmp pads
AssigneeApplied Materials, Inc.
InventorsRobert D. TOLLES, Mahendra C. ORILALL, Fred C. REDEKER, Rajeev BAJAJ
Life of this patent
Estimating the term…
Abstract
The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.
Claims20
A polishing article, comprising:
- a layer consisting of randomly distributed fibers having a diameter of about 10 nanometers to about 200 micro meters and a density of about 0.1 grams per square centimeter to about 50 grams per square centimeter.
A polishing article, comprising:
- a first layer having a thickness of about 0.007 inches to about 0.001 inches comprising random fibers having a diameter of about 10 nanometers to about 200 micro meters;
- and
- a second layer adhered to a backside of the first layer.
A method of removing material from a substrate, comprising:
- urging a substrate toward a fibrous layer on a platen, the fibrous layer disposed between a supply roll and a take-up roll and having a thickness less than about 0.032 inches and consisting of fibers having a diameter of about 10 nanometers to about 200 micro meters;
- rotating the platen, and the supply roll and the take-up roll, relative to the substrate;
- removing material from a surface of the substrate;
- and
- advancing the fibrous layer relative to the platen after removing material from the substrate.
Dependencies are inferred from the claim text.