Substrate cutting device and substrate cutting method

A substrate cutting device for cutting a substrate from one surface and the other surface of the substrate, the substrate cutting device comprising:

• a first cutter for cutting the substrate from the one surface, the first cutter including a plurality of first rotary blades;
• a second cutter for cutting the substrate from the other surface, the second cutter including a plurality of second rotary blades;
• a first rotation drive unit for rotationally driving the first cutter;
• a second rotation drive unit for rotationally driving the second cutter;
• a cutter support unit for supporting the first cutter and the second cutter in such a manner that the first cutter and the second cutter are radially opposed to each other so that rotation axes of the first cutter and the second cutter are parallel to each other;
• and
• a phase adjustment unit for adjusting a phase of at least one of the first cutter and the second cutter in such a manner that each of the second rotary blades is located between two adjacent first rotary blades in an opposing area in which the first cutter and the second cutter are opposed to each other.