Methiod of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates

A method of assembling an implantable electrode array, said method including the steps of:

• packaging at least one control module according to the steps of:
• forming a containment ring on a first surface of a substrate;
• mounting a control module to the first surface of the substrate so that the control module is disposed in the containment ring;
• applying a coating to the first surface of the substrate so that the coating is disposed in the containment ring around the control module so that the coating forms a non-porous shell in the containment ring around the control module;
• bonding a lid over the containment ring so that the lid extends over the control module and the shell so as to form at least one packaged control module
• embedding the at least one packaged control module in a flexible carrier;
• and
• electrically connecting the at least one packaged control module to at least one electrode that is disposed over or embedded in the flexible carrier.