Photosensitive Assembly and Camera Module and Manufacturing Method Thereof

34:

• The photosensitive assembly, as recited in claim 33, wherein said window is an indented recess and said photosensitive element is received in said recess.

35:

• The photosensitive assembly, as recited in claim 34, wherein one end of each of said electrical connectors is electrically connected to said non-photosensitive area of said photosensitive element and another end of each of said electrical connectors is electrically connected to a top side of said recess of said window.

36:

• The photosensitive assembly, as recited in claim 33, wherein said window is a through hole, wherein one end of each of said electrically connectors is electrically connected to said non-photosensitive area of said photosensitive element and another end of each of said electrically connectors is electrically connected with said circuit provided on said top side of said board body of said window circuit board.

37:

• The photosensitive assembly, as recited in claim 34, wherein a gap is provided between said photosensitive element and an inner wall of said window circuit board defining said window, wherein said packaging body extends into said gap to form an inserting portion bonding side edges of said photosensitive element with said inner wall so as to reinforce and strengthen the integral structure of said photosensitive element, said window circuit board and said packaging body of said photosensitive assembly.

38:

• The photosensitive assembly, as recited in claim 36, wherein a gap is provided between said photosensitive element and an inner wall of said window circuit board defining said window, wherein said packaging body extends into said gap to form an inserting portion bonding side edges of said photosensitive element with said inner wall so as to reinforce and strengthen the integral structure of said photosensitive element, said window circuit board and said packaging body of said photosensitive assembly.

39:

• The photosensitive assembly, as recited in claim 33, wherein said thickness of said photosensitive element is thinner than a depth of said window.

40:

• The photosensitive assembly, as recited in claim 36, wherein said thickness of said photosensitive element is thinner than a depth of said window.

41:

• The photosensitive assembly, as recited in claim 37, wherein said thickness of said photosensitive element is thinner than a depth of said window.

42:

• The photosensitive assembly, as recited in claim 38, wherein said thickness of said photosensitive element is thinner than a depth of said window.

43:

• The photosensitive assembly, as recited in claim 39, further comprising a substrate attached to a bottom of said photosensitive element.

44:

• The photosensitive assembly, as recited in claim 40, further comprising a substrate attached to a bottom of said photosensitive element.

45:

• The photosensitive assembly, as recited in claim 41, further comprising a substrate attached to a bottom of said photosensitive element.

46:

• The photosensitive assembly, as recited in claim 36, wherein said packaging body further comprises a packaging layer integrally packaged at a bottom of said board body.

47:

• The photosensitive assembly, as recited in claim 37, wherein said packaging body further comprises a packaging layer extended from said inserting portion and integrally packaged with at least a bottom of said board body.

48:

• The photosensitive assembly, as recited in claim 38, wherein said packaging body further comprises a packaging layer extended from said inserting portion and integrally packaged with at least a bottom of said board body.

49:

• The photosensitive assembly, as recited in claim 37, wherein said packaging layer is integrally packaged with a bottom of said photosensitive element.

50:

• The photosensitive assembly, as recited in claim 38, wherein said packaging layer is integrally packaged with a bottom of said photosensitive element.

51:

• The photosensitive assembly, as recited in claim 44, wherein said packaging body further comprises a packaging layer integrally packaged with bottoms of said board body and said substrate.

52:

• The photosensitive assembly, as recited in claim 33, further comprising an optical filter provided on said photosensitive element.

53:

• The photosensitive assembly, as recited in claim 33, further comprising an optical filter provided on said photosensitive element, wherein said packaging body extended to a periphery of said optical filter so that said window circuit board, said photosensitive element and said optical filter are integrally packaged by said packaging body.

54:

• The photosensitive assembly, as recited in claim 34, further comprising an optical filter provided on said photosensitive element, wherein said packaging body extended to a periphery of said optical filter so that said window circuit board, said photosensitive element and said optical filter are integrally packaged by said packaging body.

55:

• The photosensitive assembly, as recited in claim 36, further comprising an optical filter provided on said photosensitive element, wherein said packaging body extended to a periphery of said optical filter so that said window circuit board, said photosensitive element and said optical filter are integrally packaged by said packaging body.

56:

• The photosensitive assembly, as recited in claim 41, further comprising an optical filter provided on said photosensitive element, wherein said packaging body extended to a periphery of said optical filter so that said window circuit board, said photosensitive element and said optical filter are integrally packaged by said packaging body.

57:

• The photosensitive assembly, as recited in claim 44, further comprising an optical filter provided on said photosensitive element, wherein said packaging body extended to a periphery of said optical filter so that said window circuit board, said photosensitive element and said optical filter are integrally packaged by said packaging body.

58:

• The photosensitive assembly, as recited in claim 49, further comprising an optical filter provided on said photosensitive element, wherein said packaging body extended to a periphery of said optical filter so that said window circuit board, said photosensitive element and said optical filter are integrally packaged by said packaging body.

59:

• The photosensitive assembly, as recited in claim 50, further comprising an optical filter provided on said photosensitive element, wherein said packaging body extended to a periphery of said optical filter so that said window circuit board, said photosensitive element and said optical filter are integrally packaged by said packaging body.

60:

• The photosensitive assembly, as recited in claim 33, further comprising an optical filter installed at an installation site of said packaging body and positioned above said photosensitive element.

61:

• The photosensitive assembly, as recited in claim 34, further comprising an optical filter installed at an installation site of said packaging body and positioned above said photosensitive element.

62:

• The photosensitive assembly, as recited in claim 37, further comprising an optical filter installed at an installation site of said packaging body and positioned above said photosensitive element.

63:

• The photosensitive assembly, as recited in claim 38, further comprising an optical filter installed at an installation site of said packaging body and positioned above said photosensitive element.

64:

• The photosensitive assembly, as recited in claim 41, further comprising an optical filter installed at an installation site of said packaging body and positioned above said photosensitive element.

65:

• The photosensitive assembly, as recited in claim 42, further comprising an optical filter installed at an installation site of said packaging body and positioned above said photosensitive element.

66:

• The photosensitive assembly, as recited in claim 45, further comprising an optical filter installed at an installation site of said packaging body and positioned above said photosensitive element.

67:

• The photosensitive assembly, as recited in claim 47, further comprising an optical filter installed at an installation site of said packaging body and positioned above said photosensitive element.

68:

• The photosensitive assembly, as recited in claim 48, further comprising an optical filter installed at an installation site of said packaging body and positioned above said photosensitive element.

69:

• The photosensitive assembly, as recited in claim 33, wherein said packaging body further comprises a lens portion upwardly extended to define a lens receiving chamber on top of the light window therein for installing the lens therein.

70:

• The photosensitive assembly, as recited in claim 37, wherein said packaging body further comprises a lens portion upwardly extended to define a lens receiving chamber on top of the light window therein for installing the lens therein.

71:

• The photosensitive assembly, as recited in claim 38, wherein said packaging body further comprises a lens portion upwardly extended to define a lens receiving chamber on top of the light window therein for installing the lens therein.

72:

• The photosensitive assembly, as recited in claim 33, further comprising a blocking element which is provided at a position where said packaging body and said photosensitive element are in contact with each other and outside said photosensitive area of said photosensitive element to prevent said packaging body from extending to said photosensitive area of said photosensitive element.

73:

• The photosensitive assembly, as recited in claim 72, wherein said blocking member is configured to be ring-shaped and formed of a colloid element having a predetermined shape.

74:

• The photosensitive assembly, as recited in claim 37, further comprising a blocking element which is provided at a position where said packaging body and said photosensitive element are in contact with each other and outside said photosensitive area of said photosensitive element to prevent said packaging body from extending to said photosensitive area of said photosensitive element.

75:

• The photosensitive assembly, as recited in claim 74, wherein said blocking member is configured to be ring-shaped and formed of a colloid element having a predetermined shape.

76:

• The photosensitive assembly, as recited in claim 38, further comprising a blocking element which is provided at a position where said packaging body and said photosensitive element are in contact with each other and outside said photosensitive area of said photosensitive element to prevent said packaging body from extending to said photosensitive area of said photosensitive element.

77:

• The photosensitive assembly, as recited in claim 76, wherein said blocking member is configured to be ring-shaped and formed of a colloid element having a predetermined shape.

78:

• The photosensitive assembly, as recited in claim 33, wherein said window circuit board has at least one reinforcing hole formed therein and said packaging body has at least one inserting portion extended into said reinforcing hole to further engage said packaging body with said window circuit board so as to reinforce a structural strength of said window circuit board.

79:

• The photosensitive assembly, as recited in claim 78, wherein said at least one reinforcing hole is a through hole communicating both sides of said board body said window circuit board and said inserting portion of said packaging body is extended into said reinforcing hole.

80:

• The photosensitive assembly, as recited in claim 37, wherein said window circuit board has at least one reinforcing hole formed therein and said packaging body has at least one inserting portion extended into said reinforcing hole to further engage said packaging body with said window circuit board so as to reinforce a structural strength of said window circuit board.

81:

• The photosensitive assembly, as recited in claim 80, wherein said at least one reinforcing hole is a through hole communicating both sides of said board body said window circuit board and said inserting portion of said packaging body is extended into said reinforcing hole.

82:

• The photosensitive assembly, as recited in claim 38, wherein said window circuit board has at least one reinforcing hole formed therein and said packaging body has at least one inserting portion extended into said reinforcing hole to further engage said packaging body with said window circuit board so as to reinforce a structural strength of said window circuit board.

83:

• The photosensitive assembly, as recited in claim 82, wherein said at least one reinforcing hole is a through hole communicating both sides of said board body said window circuit board and said inserting portion of said packaging body is extended into said reinforcing hole.

85:

• The method, as recited in claim 84, further comprising a step (d) of mounting an optical filter at an installation site of said packaging body and aligning said optical filter along said light path.

86:

• The method, as recited in claim 84, wherein the step (b) further comprises a step of providing an optical filter on said photosensitive element.

87:

• The method, as recited in claim 86, wherein the step (c) further comprises a step of integrally packaging at least a periphery portion of said optical filter so that said optical filter, said photosensitive element, said window circuit board are integrally packaged by said packaging body to form an integral body as said photosensitive assembly.

88:

• The method, as recited in claim 84, further comprising a step of providing a ring-shaped blocking element at a position where said packaging body and aid photosensitive element are in contact with each other and outside said photosensitive area of said photosensitive element.

89:

• The method, as recited in claim 87, further comprising a step of providing a ring-shaped blocking element at a position where said packaging body and aid photosensitive element are in contact with each other and outside said photosensitive area of said photosensitive element.

90:

• The method, as recited in claim 84, further comprising the steps of providing at least one reinforcing hole in said window circuit board and extending an inserting portion of said packaging body into said reinforcing hole to further engaging said packaging body with said window circuit board.

91:

• The method, as recited in claim 87, further comprising the steps of providing at least one reinforcing hole in said window circuit board and extending an inserting portion of said packaging body into said reinforcing hole to further engaging said packaging body with said window circuit board.

92:

• The method, as recited in claim 88, further comprising the steps of providing at least one reinforcing hole in said window circuit board and extending an inserting portion of said packaging body into said reinforcing hole to further engaging said packaging body with said window circuit board.