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US 2018/0006639 A1Published application
Electronic Switching and Reverse Polarity Protection Circuit
AssigneeInfineon Technologies AG
InventorsRainald Sander, Andreas Meiser
Life of this patent
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AssigneeInfineon Technologies AG
InventorsRainald Sander, Andreas Meiser
Estimating the term…
In accordance with an embodiment, an electronic circuit includes a first transistor device, at least one second transistor device, and a drive circuit. The first transistor device is integrated in a first semiconductor body, and includes a first load pad at a first surface of the first semiconductor body and a control pad and a second load pad at a second surface of the first semiconductor body. The at least one second transistor device is integrated in a second semiconductor body, and includes a first load pad at a first surface of the second semiconductor body and a control pad and a second load pad at a second surface of the second semiconductor body. The first load pad of the first transistor device and the first load pad of the at least one second transistor device are mounted to an electrically conducting carrier.
An electronic circuit, comprising:
A packaged semiconductor circuit comprising:
A method of operating a circuit comprising an electrically conductive carrier, a first transistor device integrated in a first semiconductor body disposed on the electrically conductive carrier, a second transistor device integrated in a second semiconductor body disposed on the electrically conductive carrier, and a drive circuit having a first output connected to a control pad of the first transistor device via a first conductive connection, and a second output connected to a control pad of the second transistor device via a second conductive connection, wherein the first transistor device comprises a first load pad disposed on a first side of the first semiconductor body against the electrically conductive carrier and a second load pad disposed on a second side of the first semiconductor body opposite the first side of the first semiconductor body, and the second transistor device comprises a first load pad disposed on a first side of the second semiconductor body against the electrically conductive carrier and a second load pad disposed on a second side of the second semiconductor body opposite the first side of the second semiconductor body, the method comprising:
Dependencies are inferred from the claim text.