Semiconductor device and measurement device

A semiconductor device, comprising:

• an electronic component that comprises an oscillator and comprises a plurality of terminals on one face;
• a semiconductor chip that is electrically connected to the electronic component and comprises a plurality of terminals on one face;
• a mounting base including a mounting section to which the electronic component and the semiconductor chip are each directly mounted on one face of the mounting base, such that the plurality of terminals of the electronic component and the plurality of terminals of the semiconductor chip face in a same direction, and a plurality of leads formed at a periphery of the mounting section, each of the plurality of leads including a mounting base terminal;
• first bonding wires that connect at least two of the plurality of terminals of the semiconductor chip to the mounting base terminals;
• second bonding wires that directly connect at least two of the plurality of terminals of the electronic component to the plurality of terminals of the semiconductor chip, and that have an apex height that is smaller than that of the first bonding wires;
• a third bonding wire that connects the mounting section to one of the mounting base terminals;
• and
• a sealing member that completely seals at least the electronic component inside the sealing member.