Motor device
AssigneeDenso Corporation
InventorsYasuhiro ISHIMOTO, Kazuyuki WATANABE, Takuya MATSUYAMA
Life of this patent
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Abstract
A printed circuit board and multiple components, which are mounted on both sides of the printed circuit board, form a circuit to drive a motor. The printed circuit board is opposed to a case at a one side. First thermal conductive portion is interposed between a heat generating component of the components and the case. Second thermal conductive portion is interposed between the circuit board and the case. The first and second thermal conductive portions are formed of the same flexible material, are equipped to the same side of the circuit board, are in contact with both the circuit board and the case, and are located at different positions.
Claims6
A motor device comprising:
- a case including a base and a cover, the base being formed of a metallic material and having a surface and a cover mounting surface, which is on an opposite side of the surface, the cover equipped to the cover mounting surface of the base and defining an accommodation space with the base;
- a motor located on a side of the surface of the base;
- a circuit board located in the accommodation space and including a printed circuit board and a plurality of components forming a circuit to drive the motor, the printed circuit board containing resin as a base material and having a one side and a rear side, the one side being opposed to the base, the rear side being on an opposite side of the one side in a thickness direction, the components being mounted on both the one side and the rear side of the printed circuit board;
- and
- a thermal conduction member having a flexibility and interposed between the circuit board and the case in the thickness direction, the thermal conduction member being in contact with both the circuit board and the case, wherein
- the components include a heat generating component located on at least one of the one side and the rear side of the printed circuit board,
- the thermal conduction member includes a first thermal conductive portion and at least one second thermal conductive portion,
- the first thermal conductive portion is interposed between the heat generating component and the case,
- the at least one second thermal conductive portion is formed of a material same as a material of the first thermal conductive portion,
- the at least one second thermal conductive portion is located on a same side as the first thermal conductive portion on the circuit board, and
- the at least one second thermal conductive portion is interposed with the case at a second position different from a first position of the first thermal conductive portion.
Dependencies are inferred from the claim text.