Circuit assembly and electrical junction box
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorTatsuya Sumida
Life of this patent
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Abstract
Provided is a circuit assembly that enables suppression of a decrease in heat dissipation properties. A circuit assembly includes a circuit board having a conductive path, a heat dissipation member on which the circuit board is placed, and an insulating layer that is interposed between the circuit board and the heat dissipation member. A surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, and the circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface.
Claims9
A circuit assembly comprising:
- a circuit board having a conductive path;
- a heat dissipation member on which the circuit board is placed;
- and
- an insulating layer that is interposed between the circuit board and the heat dissipation member,
- wherein a surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, and
- the circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface.
Dependencies are inferred from the claim text.