Piezoelectric package-integrated sensing devices

A computing device comprising:

• at least one processor to process data;
• and
• a package substrate coupled to the at least one processor, the package substrate includes a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate which includes a piezoelectric sensing device having a base structure with a proof mass that is positioned in proximity to a cavity of the package substrate, a piezoelectric material in contact with a first electrode of the base structure and a second electrode in contact with the piezoelectric material, wherein the proof mass deflects in response to application of an external force or acceleration and this deflection causes a stress in the piezoelectric material which generates a voltage differential between the first and second electrodes.