Method for manufacturing light-emitting device

A method for manufacturing a light-emitting device, the method comprising:

• providing a first substrate and a second substrate each including a plurality of packages, the packages each having a recess and a light-emitting element mounted in the recess;
• performing potting by supplying a resin member containing particles of a fluorescent material into the recess of each of the packages of the first substrate;
• spreading the resin member in the recess of each of the packages of the first substrate;
• measuring a height of an upper surface of the resin member spread in the recess of at least one of the packages of the first substrate;
• and
• adjusting a quantity of the resin member to be supplied into the recess of each of the packages of the second substrate depending on the measured height of the upper surface of the resin member spread in the recess of the at least one of the packages of the first substrate.