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US 2018/0006193 A1Published application
Optoelectronic module and a process for the production of an optoelectronic module
AssigneeOSRAM Opto Semiconductors GmbH
InventorsUlrich FREI, Rainer HUBER
Life of this patent
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Abstract
An optoelectronic module (100) is defined, comprising at least one semiconductor chip (10) provided for emitting electromagnetic radiation and at least one holding device (20) which is adapted to fix in place a device (50) for encoding at least one optical or electronic parameter of the optoelectronic module (100). Furthermore, a process for the production of the optoelectronic module (100) is defined.
Claims17
A process for the production of an optoelectronic module having the steps of:
- a) providing an optoelectronic module having at least one semiconductor chip provided for emitting electromagnetic radiation;
- b) measuring an optical or electronic parameter of the optoelectronic module;
- c) providing an encoding element, especially in the form of a surface-mountable device, wherein the encoding element carries information relating to the optical or electronic parameter of the optoelectronic module;
- and
- d) fixing the encoding element in place in or on the optoelectronic module.
2 more elements
A process for the production of an optoelectronic module having the steps of:
- a) providing an optoelectronic module having at least one semiconductor chip provided for emitting electromagnetic radiation;
- b) measuring an optical or electronic parameter of the optoelectronic module;
- c) providing an encoding element in the form of a surface-mountable device having two electrical contact surfaces wherein the encoding element carries information relating to the optical or electronic parameter of the optoelectronic module;
- and
- d) fixing the encoding element in place in or on the optoelectronic module, wherein the optoelectronic module has a holding device which comprises a recess and electrical contact elements being arranged on a base face of the recess, wherein in a fixing position, the two electrical contact surfaces of the encoding element lie on the electrical contact elements in the recess.
2 more elements
Dependencies are inferred from the claim text.