Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the same

A wafer-level method of manufacturing optoelectronic device subassemblies, the method comprising:

• providing a substrate on which optoelectronic devices are mounted;
• forming respective trenches in respective regions of opaque encapsulant separating adjacent ones of the optoelectronic devices from one another, wherein each trench extends at least partially through the opaque encapsulant, the opaque encapsulant being substantially opaque to a wavelength or range of wavelengths of radiation emitted by or detectable by the optoelectronic devices;
• and
• dicing the substrate at locations of the trenches so as to form singulated optoelectronic device subassemblies each of which includes at least one of the optoelectronic devices surrounded laterally by the opaque encapsulant.