Optical sensor package including a cavity formed in an image sensor die
AssigneeStmicroelectronics Pte Ltd
InventorsLoic Pierre Louis RENARD, Cheng-Lay ANG
Life of this patent
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Abstract
One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
Claims24
An optical sensor package comprising:
- a substrate;
- an image sensor die coupled to the substrate, the image sensor die comprising a semiconductor material and including:
- a first surface coupled to the substrate,
- a second surface,
- a recess extending into the image sensor die from the first surface toward the second surface, the recess forming a cavity with a surface of the substrate, and
- a light transmissive layer formed at the second surface and facing the recess;
- and
- a light-emitting device coupled to the substrate and positioned within the cavity.
A method comprising:
- electrically and mechanically coupling a light-emitting device to a substrate;
- placing an image sensor die having a recess over the light-emitting device such that the light-emitting device is located in the recess, the image sensor die including a semiconductor material;
- and
- electrically and mechanically coupling the image sensor die to the substrate with the light-emitting device located in recess of the image sensor die.
An electronic device comprising:
- a microprocessor;
- and
- an optical sensor package coupled to the microprocessor, the optical sensor package including:
- a substrate;
- an image sensor die coupled to the substrate, the image sensor die being made from silicon, the image sensor die including:
- a first surface coupled to the substrate,
- a second surface including an image sensor region,
- a recess extending into the image sensor die from the first surface toward the second surface, and
- a light transmissive layer formed at the second surface and facing the recess;
- a light-emitting device coupled to the substrate and positioned within the cavity in the image sensor die;
- and
- a cap positioned around side surfaces of the image sensor die and covering at least a portion of the second surface of the image sensor die, the cap having sidewalls and an inner wall, the inner wall optically separating the light-emitting device from the image sensor region.
An optical sensor package comprising:
- a substrate;
- an image sensor die coupled to the substrate, the image sensor die comprising a semiconductor material and including:
- a first surface coupled to the substrate,
- a second surface,
- a recess extending into the image sensor die from the first surface toward the second surface, the recess forming a cavity with a surface of the substrate;
- and
- a light-emitting device coupled to the substrate and positioned within the cavity.
Dependencies are inferred from the claim text.