Metallization structures for solar cells
AssigneeSunPower Corporation
InventorsMatthieu Moors, Taeseok Kim, Nils-Peter Harder
Life of this patent
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Abstract
Solar cells having conductive contacts are described. In an example, a solar cell can include a protective layer disposed over a substrate, where the protective layer comprises a contact hole. A first metal layer disposed over the protective layer, where the first metal layer is electrically connected to the substrate through the contact hole. A second metal layer disposed over the first metal layer and a bond region disposed between the first metal layer and the second metal layer, where the bond region is located above a region of the protective layer without a contact hole.
Claims23
A solar cell comprising:
- a protective layer disposed over a substrate, wherein the protective layer comprises a contact hole;
- a first metal layer disposed over the protective layer, wherein the first metal layer is electrically connected to the substrate through the contact hole;
- a second metal layer disposed over the first metal layer;
- and
- a bond region disposed between the first metal layer and the second metal layer, wherein the bond region is located above a region of the protective layer without a contact hole.
A solar cell comprising:
- a semiconductor region disposed in or above a substrate;
- a protective layer disposed over a the semiconductor region, wherein the protective layer comprises a contact hole;
- a metal seed layer disposed over a the semiconductor region, wherein a contact region electrically connects the metal seed layer to the semiconductor region;
- a metal foil disposed over the metal seed layer;
- and
- a metal weld disposed between the metal seed layer and the metal foil, wherein the metal weld is located above a region of the protective layer without a contact hole.
-18. (canceled)
(canceled)
A method of fabricating a solar cell, the method comprising:
- forming a protective layer over a substrate;
- forming a contact hole in the protective layer;
- forming a first metal layer over the protective layer, wherein the first metal layer is electrically connected to the substrate through the contact hole;
- placing a metal foil over the first metal layer;
- and
- forming a bond region between the first metal layer and the metal foil, wherein the protective layer inhibits damage to the substrate during the formation of the bond region at a region of the protective layer without a contact hole.
-27. (canceled)
Dependencies are inferred from the claim text.