Chip part and method of making the same

A chip diode, including:

• a p type semiconductor substrate;
• an n type diffusion layer formed on the p type semiconductor substrate, the n type diffusion layer forming a p-n junction region with the p type semiconductor substrate;
• an insulating film covering a principal surface of the p type semiconductor substrate and having a cathode contact hole exposing the n type diffusion layer;
• a cathode electrode having a cathode lead-out electrode contacting the n type diffusion layer via the cathode contact hole, and being led out onto the insulating film in a region outside of the cathode contact hole, the cathode electrode also having a cathode external connection portion connected to the cathode lead-out electrode and being disposed on the insulating film in the region outside of the cathode contact hole;
• and
• an anode electrode having an electrode film contacting the p type semiconductor substrate.