Sensor chip stack and method of producing a sensor chip stack
Assigneeams International AG
InventorsGeorg PARTEDER, Jochen KRAFT, Franz SCHRANK, Thomas TROXLER, Andreas FITZI
Life of this patent
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Abstract
The sensor chip stack comprises a sensor substrate of a semiconductor material including a sensor, a chip fastened to the sensor substrate, the chip including an integrated circuit, electric interconnections between the sensor substrate and the chip, electric terminals of the chip, the chip being arranged between the electric terminals and the sensor substrate, and a molding material arranged adjacent to the chip, the electric terminals of the chip being free from the molding material.
Claims16
A sensor chip stack, comprising:
- a sensor substrate of a semiconductor material including a sensor or plurality of sensors;
- a chip fastened to the sensor substrate, the chip including an integrated circuit;
- electric interconnections between the sensor substrate and the chip;
- electric terminals of the chip, the chip being arranged between the electric terminals and the sensor substrate;
- and
- a molding material arranged adjacent to the chip, the electric terminals of the chip being free from the molding material.
A method of producing a sensor chip stack, comprising:
- providing a sensor substrate including a plurality of sensors;
- providing a plurality of chips including an integrated circuit and contact pads;
- fastening the chips to the sensor substrate and forming electric interconnections between the sensor substrate and the chips;
- forming electric terminals of the chips, the chips being arranged between the electric terminals and the sensor substrate;
- and
- filling interspaces between the chips with a molding material without covering the electric terminals.
A sensor chip stack, comprising:
- a sensor substrate of a semiconductor material including a sensor or plurality of sensors;
- bond pads of the sensor substrate;
- a chip fastened to the sensor substrate, the chip including an integrated circuit;
- contact pads of the chip, the contact pads facing the bond pads;
- pad connections including via bumps between the sensor substrate and the chip, each of the pad connections electrically connecting one of the bond pads and one of the contact pads;
- electric terminals of the chip, the chip being arranged between the electric terminals and the sensor substrate;
- and
- a molding material arranged adjacent to the chip, the electric terminals of the chip being free from the molding material.
Dependencies are inferred from the claim text.