Image sensor, method of manufacturing the same, and electronic apparatus

Abstract

The present disclosure relates to an image sensor, a method of manufacturing the image sensor, and an electronic apparatus where reliability of the image sensor can be further improved. The image sensor includes: a sensor substrate provided with a sensor surface on which a photodiode is arranged in a planar manner; a sealing resin applied to a side of the sensor surface of the sensor substrate; sealing glass bonded to the sensor substrate via the sealing resin; and a reinforcing resin made of a resin material having higher rigidity than the sealing resin and formed on an outer periphery of the sealing resin to bond the sensor substrate and the sealing glass. The sealing resin is formed to have a smaller area than each of the sensor substrate and the sealing glass, so that the reinforcing resin is formed to fill a gap provided on the outer periphery of the sealing resin, the sensor substrate and the sealing glass facing each other through the gap. The present technology can be applied to a CMOS image sensor, for example.

Dependencies are inferred from the claim text.