Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate

A method of making a semiconductor device, comprising:

• providing a substrate;
• forming a first interconnect structure over the substrate;
• disposing a semiconductor die over the first interconnect structure;
• forming a second interconnect structure over the semiconductor die with the semiconductor die between the first interconnect structure and second interconnect structure;
• and
• removing the substrate to expose the first interconnect structure after forming the second interconnect structure over the semiconductor die.

A method of making a semiconductor device, comprising:

• providing a substrate;
• forming a first interconnect structure over the substrate;
• disposing a first semiconductor die over the first interconnect structure;
• disposing the substrate over a carrier with the substrate oriented toward the carrier;
• depositing an encapsulant over the first semiconductor die and substrate;
• and
• forming a second interconnect structure over the encapsulant.

A semiconductor device, comprising:

• a carrier;
• a substrate disposed over the carrier;
• a first interconnect structure formed over the substrate;
• a first semiconductor die disposed over the first interconnect structure;
• an encapsulant disposed over the carrier, substrate, first interconnect structure, and first semiconductor die;
• and
• a second interconnect structure formed over the encapsulant.