Input output for an integrated circuit
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChin-Ming FU
Life of this patent
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Abstract
A three-dimensional integrated circuit has a plurality of layers disposed in a stacked relationship. Logic circuitry is embodied in a first layer of the three-dimensional integrated circuit. An input output circuit is electrically coupled to the logic circuitry and has a plurality of transistors embodied in at least two layers of the three-dimensional integrated circuit. The input output circuit has first and second input output circuitry, wherein the first input output circuitry operates faster than the second input output circuitry.
Claims20
A three-dimensional integrated circuit having a plurality of layers disposed in a stacked relationship, comprising:
- logic circuitry having one or more transistors and embodied in a first layer of said three-dimensional integrated circuit;
- an input output circuit electrically coupled to said logic circuitry and having a plurality of transistors embodied in at least two layers of said three-dimensional integrated circuit, said input output circuit comprising:
- first input output circuitry adapted to operate at a first speed, and
- second input output circuitry adapted to operate at a second speed that is slower than said first speed.
A method of using a three-dimensional integrated circuit having a plurality of layers disposed in a stacked relationship, wherein logic circuitry having one or more transistors is embodied in a first layer of said three-dimensional integrated circuit, an input output circuit electrically coupled to said logic circuitry has a plurality of transistors embodied in at least two layers of said three-dimensional integrated circuit, said input output circuit comprising first input output circuitry adapted to operate at a first speed, and second input output circuitry adapted to operate at a second speed that is slower than said first speed, the method comprising:
- providing electrical power to said three-dimensional integrated circuit;
- generating a first signal in said logic circuitry embodied in said first layer of said three-dimensional integrated circuit;
- providing said first signal to said first input output circuitry of said three-dimensional integrated circuit;
- outputting, at said first speed, said first signal from said input output circuitry to a component external to said three-dimensional integrated circuit;
- receiving and processing said first signal in said external component;
- generating a second signal in said logic circuitry embodied in said first layer of said three-dimensional integrated circuit;
- providing said second signal to said second input output circuitry of said three-dimensional integrated circuit;
- outputting, at said second speed, said second signal from said second input output circuitry;
- and
- receiving and processing said second signal external to said three-dimensional integrated circuit.
A method of making a three-dimensional integrated circuit including logic circuitry having one or more transistors and embodied in a first layer of said three-dimensional integrated circuit, an input output circuit electrically coupled to said logic circuitry and having a plurality of transistors embodied in at least two layers of said three-dimensional integrated circuit, said input output circuit including first input output circuitry adapted to operate at a first speed, and second input output circuitry adapted to operate at a second speed that is slower than said first speed, said method comprising:
- designing the layout of said logic circuitry and the layout of said first input output circuitry;
- designing the layout of said second input output circuitry;
- and
- storing said layouts in non-transitory machine readable storage media useable to fabricate said three-dimensional integrated circuit.
Dependencies are inferred from the claim text.