US 2018/0005991 A1 · INTEGRATED CIRCUIT PACKAGE ASSEMBLIES INCLUDING A CHIP RECESS

Abstract

IC package assemblies including a molding compound in which an IC chip surface is recessed relative to the molding compound. Thickness of the IC chip may be reduced relative to its thickness during the molding process. Another IC chip, heat spreader, etc. may then occupy the resultant recess framed by the molding compound to achieve a fine stacking pitch. In some embodiments, a package-on-package (PoP) assembly includes a center-molded IC chip flip-chip-bonded to a first package substrate. A second substrate to which a second IC chip is flip-chip bonded is then electrically coupled to the first substrate by through-molding vias. Within the PoP assembly, the second IC chip may be disposed back-to-back with the center-molded IC chip so as to occupy the recess framed by the molding compound.

Claims19

Dependent claims

An integrated circuit (IC) package assembly, comprising:

an IC chip having a first thickness, the IC chip including a front side having a plurality of metal features, and a back side opposite the front side;
a molding compound in contact with an edge of the IC chip, wherein the molding compound has a second thickness that is greater than the first thickness, and a sidewall of the molding compound extending from the edge of the IC chip defines a recess over the back side of the IC chip;
and
a component at least partially occupying the recess, wherein an edge of the component and the sidewall of the molding compound has a separation therebetween.

1 more element

Dependencies are inferred from the claim text.

Integrated circuit package assemblies including a chip recess

Life of this patent

Integrated circuit package assemblies including a chip recess

Life of this patent

Abstract

Claims19