Multichip packaging for dice of different sizes

A method, comprising:

• coupling a first die having a first side and a second side opposite the first side and a second die having a first side and a second side opposite the first side, wherein the second side of the first die is smaller than the first side of the second die and coupled with the first side of the second die such that a portion of the first side of the second die is exposed;
• forming a casing surrounding first wires extending from the portion of the first side of the second die and second wires extending from first side of the first die and covering the first side of the first die and the portion of the first side of the second die, wherein ends of the first and second plurality of wires are exposed at a first side of the casing opposite a second side that is directly adjacent to the first and second die;
• and
• forming a redistribution layer (RDL) coupled with the first side of the casing and electrically coupled with the first and second plurality of wires.

A system, comprising:

• a first device having a single semiconductor package for a stack of differently-sized semiconductor dice of the first device, wherein a dimension of a first semiconductor die of the stack is greater than a dimension of a second semiconductor die of the stack that is next to the first semiconductor die in the stack such that the second semiconductor die exposes a surface of the first semiconductor die,
• wherein the single semiconductor package includes a casing surrounding elongated conductive structures secured to bond pads on the exposed surface of the first semiconductor die, wherein each elongated conductive structure extends from the exposed surface to at least a plane that is coplanar with an end of the stack, and wherein each elongated conductive structure includes a first section and a second different section between the first section and a respective one of the bond pads;
• and
• a second device coupled to at least one of the elongated conductive structures via an external interface of the semiconductor package.

An apparatus, comprising:

• means for encapsulating sides of elongated conductive structures having first ends attached to bond pads on a surface of a first semiconductor die of a stack of differently-sized semiconductor dice, wherein each elongated conductive structure includes a first section and a second different section between the first section and a respective one of the bond pads;
• wherein said surface is exposed by a second semiconductor die that is smaller than the first semiconductor die and next to the first semiconductor die in the stack;
• wherein the elongated conductive structures extend from the surface and have second ends different than the first ends;
• and
• means for connecting one of the second ends to an exposed end of at least one of elongated conductive structures extending away from an exposed surface of the second semiconductor die.