US 2018/0005989 A1Published application

Integrated circuit package stack

AssigneeIntel Corporation

InventorsSaikumar Jayaraman, John S. Guzek, Yidnekachew S. Mekonnen

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Abstract

Apparatuses, methods and systems associated with integrated circuit (IC) package design are disclosed herein. An IC package stack may include a first IC package and a second IC package. The first IC package may include a first die and a first redistribution layer that communicatively couples contacts on the first side of the first IC package to the first die and to contacts on a second side of the first IC package, the second side opposite to the first side. The second IC package may be mounted to the second side of the first IC package. The second IC package may include a second die and a second redistribution layer that communicatively couples contacts on a side of the second IC package to the second die, the contacts of the second IC package communicatively coupled to the contacts on the second side of the first IC package.

Claims16

Dependent claims

An integrated circuit (IC) package stack, comprising:

a first IC package, a first side of the first IC package to be mounted to a circuit board, the first IC package includes:
a first die;
a first redistribution layer that communicatively couples contacts on the first side of the first IC package to the first die and to contacts on a second side of the first IC package, the second side opposite to the first side;
a first set of vias that communicatively couples the contacts on the first side of the first IC package to the first redistribution layer;
and
a second set of vias that communicatively couples the first redistribution layer to the contacts on the second side of the first IC package, wherein the first set of vias are formed within a substrate of the first IC package and the second set of vias are formed within a molded layer of the first IC package;
and
a second IC package mounted to the second side of the first IC package, the second IC package includes:
a second die;
a second redistribution layer that communicatively couples contacts on a side of the second IC package to the second die, the contacts of the second IC package communicatively coupled to the contacts on the second side of the first IC package.

7 more elements

A system, comprising:

a circuit board;
and
an integrated circuit (IC) package stack communicatively coupled to the circuit board, the IC package stack including:
a first IC package, a first side of the first IC package coupled to the circuit board, the first IC package includes:
a first die;
a first redistribution layer that communicatively couples one or more contacts on the first side of the first IC package to one or more contacts on a second side of the first IC package, the second side of the first IC package opposite to the first side of the first IC package;
a first set of vias that communicatively couples the one or more contacts on the first side of the first IC package to the first redistribution layer;
and
a second set of vias that communicatively couples the first redistribution layer to the one or more contacts on the second side of the first IC package, wherein the first set of vias are formed within a substrate of the first IC package and the second set of vias are formed within a molded layer of the first IC package;
and
a second IC package mounted to the second side of the first IC package, the second IC package including:
a second die;
and
a second redistribution layer that communicatively couples, via one or more vias, one or more contacts on a side of the second IC package to the second die, the one or more contacts on the side of the second IC package communicatively coupled to the one or more contacts on the second side of the first IC package.

11 more elements

Dependencies are inferred from the claim text.