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US 2018/0005987 A1Published application
Semiconductor package and fabricating method thereof
AssigneeAmkor Technology, Inc.
InventorsDavid Hiner, Michael Kelly, Ronald Huemoeller
Life of this patent
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Abstract
A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.
Claims23
A method of making an electronic device, the method comprising:
- receiving a first portion of a signal redistribution structure;
- forming a first functional die interconnection structure on the signal redistribution structure;
- forming a second functional die interconnection structure on the signal redistribution structure;
- coupling a back side of a connect die to the signal redistribution structure, the connect die comprising a first connect die interconnection structure coupled to a front side of the connect die and a second connect die interconnection structure coupled to the front side of the connect die;
- coupling a first interconnection structure of a first functional die to the first functional die interconnection structure;
- and
- coupling a second interconnection structure of the first functional die to the first connect die interconnection structure.
4 more elements
A method of making an electronic device, the method comprising:
- providing a first functional die, wherein the first functional die comprises:
- first die interconnection structures on a front side of the first functional die, the first die interconnection structures having a first pitch;
- and
- second die interconnection structures on the front side of the first functional die, the second die interconnection structures having a second pitch greater than the first pitch;
- encapsulating the first functional die in an encapsulating material, wherein the encapsulating material covers at least a sidewall of the first functional die and does not cover the front side of the first functional die;
- and
- after said encapsulating:
- coupling a connect die to the first functional die by, at least in part, attaching first connect die interconnection structures on a front side of the connect die to the first die interconnection structures of the first functional die;
- and
- coupling the second die interconnection structures of the first functional die to a substrate.
7 more elements
A method of making an electronic device, the method comprising:
- coupling a front side of a first functional die to a carrier;
- encapsulating the first functional die coupled to the carrier in an encapsulating material;
- and
- after said encapsulating:
- removing the carrier;
- forming first die interconnection structures on the front side of the first functional die, the first die interconnection structures having a first height and a first pitch;
- forming second die interconnection structures on the front side of the first functional die, the second die interconnection structures having a second height, greater than the first height, and a second pitch, greater than the first pitch;
- coupling a connect die to the first functional die by, at least in part, connecting first connect die interconnection structures on a front side of the connect die to the first die interconnection structures of the first functional die;
- and
- coupling the second die interconnection structures of the first functional die to a substrate.
7 more elements
Dependencies are inferred from the claim text.