Power module

A power module comprising:

• a base plate;
• a first semiconductor chip having four edges;
• a second semiconductor chip having four edges, one of the four edges disposed adjacent to a first edge of the first semiconductor chip, the second semiconductor chip soldered to the base plate;
• and
• a third semiconductor chip having four edges, one of the four edges disposed adjacent to a second edge of the first semiconductor chip, the third semiconductor chip soldered to the base plate,
• wherein at least one of a third edge or a fourth edge of the first semiconductor chip is disposed adjacent to a side end of the base plate, and
• among a half of a distance from the first edge of the first semiconductor chip to the one edge of the second semiconductor chip, a half of a distance from the second edge of the first semiconductor chip to the one edge of the third semiconductor chip, and a distance from the third edge or the fourth edge of the first semiconductor chip disposed adjacent to the side end of the base plate to the side end of the base plate, a length of a solder fillet formed on the edge of the first semiconductor chip at the shortest distance is formed in the shortest length.