Semiconductor packaging device with heat sink
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorCHENG-CHIEH HSIEH
Life of this patent
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Abstract
A semiconductor packaging device includes: a first chip disposed separately from the first chip on a substrate; a second chip disposed on the substrate, wherein the first chip and the second chip comprise a first heat energy producing rating and a second heat energy producing rating, respectively, the first heat energy producing rating is different from the second heat energy producing rating; and a heat sink arranged in thermal communication with the first chip and the second chip, wherein the heat sink is arranged to have a first slot configured substantially along a separation region between the first chip and the second chip.
Claims20
A semiconductor packaging device, comprising:
- a first chip, disposed on a substrate;
- a second chip, disposed separately from the first chip on the substrate, wherein the first chip and the second chip comprise a first heat energy producing rating and a second heat energy producing rating, respectively, the first heat energy producing rating is different from the second heat energy producing rating;
- and
- a heat sink arranged in thermal communication with the first chip and the second chip, wherein the heat sink is arranged to have a first slot configured substantially along a separation region between the first chip and the second chip.
A semiconductor packaging device, comprising:
- a first chip, disposed on a substrate;
- a second chip, disposed separately from the first chip on the substrate;
- and
- a heat sink, disposed in thermal communication with the first chip and arranged at least partially over the second chip, the heat sink comprising a first heat energy dissipation rating corresponding to a first heat energy producing rating of the first chip;
- and
- a heat pipe, disposed on the second chip and at least partially under a planar projection of the heat sink, the heat pipe comprising a second heat energy dissipation rating corresponding to a second heat energy producing rating of the second chip;
- wherein the heat pipe has a first end directly attached to the second chip and a second end extended beyond the heat sink, and the first heat energy producing rating is different from the second heat energy producing rating.
A semiconductor packaging device, comprising:
- a first chip;
- a second chip, disposed separately from the first chip;
- and
- a heat sink arranged in thermal communication with the first chip and the second chip, wherein the heat sink is arranged to have a first slot for limiting heat transfer between the first chip and the second chip via the heat sink.
Dependencies are inferred from the claim text.