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US 2018/0005982 A1Published application
Via and trench filling using injection molded soldering
AssigneeInternational Business Machines Corporation
InventorsJohn U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
Life of this patent
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Abstract
A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.
Claims20
An apparatus comprising:
- a first layer having one or more vias formed therein, the first layer comprising a molding compound and an antenna disposed over the molding compound;
- at least a second layer having one or more vias formed therein, the second layer comprising an interposer and at least one passive component embedded in the interposer;
- wherein at least a first via in the first layer is aligned with at least a second via in the second layer;
- wherein the first layer and the second layer are bonded together via solder material filling the first via and the second via, the solder material being filled using injection molded soldering;
- and
- wherein the filled first and second vias provide an interconnect between the antenna and the at least one passive component.
3 more elements
An integrated circuit comprising:
- a first layer having one or more vias formed therein, the first layer comprising a molding compound and an antenna disposed over the molding compound;
- at least a second layer having one or more vias formed therein, the second layer comprising an interposer and at least one passive component embedded in the interposer;
- wherein at least a first via in the first layer is aligned with at least a second via in the second layer;
- wherein the first layer and the second layer are bonded together via solder material filling the first via and the second via, the solder material being filled using injection molded soldering;
- wherein the filled first and second vias provide an interconnect between the antenna and the at least one passive component;
- and
- wherein the interposer comprises a glass interposer.
4 more elements
Dependencies are inferred from the claim text.