Simultaneous double wire wedge bonding method, system, kit and tool
AssigneeCiena Corporation
InventorSimon Savard
Life of this patent
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Abstract
A wedge bonding method for simultaneously connecting two wires to a first component and then to a second component includes a) feeding the two wires side by side through a guide channel located at a lower end of a bonding wedge tool, b) positioning the bonding wedge tool over the first component and performing a first bond connection thereon, c) positioning the bonding wedge tool over the second component and performing a second bond connection thereon; and d) breaking tails of the two wires near the second bond connection.
Claims18
A wedge bonding method for simultaneously connecting two wires to a first component and then to a second component, comprising:
- a) feeding the two wires side by side through a guide channel located at a lower end of a bonding wedge tool;
- b) positioning the bonding wedge tool over the first component and performing a first bond connection thereon;
- c) positioning the bonding wedge tool over the second component and performing a second bond connection thereon;
- and
- d) breaking tails of the two wires near the second bond connection.
A bonding wedge tool for simultaneously connecting two wires to a first component, and then to a second component, comprising:
- a vertical hole extending therethrough, from a top aperture to a bottom aperture of the bonding wedge tool;
- a back face and a bottom face at a tapered lower end of the bonding wedge tool;
- and
- a guide channel opening on the back and the bottom faces.
The wedge bonding kit of claim 13, wherein a distance between the second wire spool support and the bonding wedge tool is between 5 cm and 80 cm.
Dependencies are inferred from the claim text.